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Ab initio modelling of silver adhesion on the corundum (0001) surface

  • Eugene A. Kotomin*
  • , Joachim Maier
  • , Yuri F. Zhukovskii
  • , David Fuks
  • , S. Dorfman
  • *Corresponding author for this work
  • Max Planck Institute for Solid State Research
  • University of Latvia
  • Ben-Gurion University of the Negev
  • Technion-Israel Institute of Technology

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Abstract

The Ag/α-Al2O3(0001) interface was simulated using ab initio slab calculations. We have studied silver adhesion on both Al- and O-terminated corundum substrates. The latter case may be considered as silver adhesion on a defective Al-terminated corundum surface with external aluminium vacancies. The dependence of the adhesion energy on the interfacial distance has been analyzed for the two favorable Ag adsorption positions and for two metal coverages (a 1/3 monolayer of the Ag(111) crystallographic plane and a full Ag(111) monolayer, 1 ML). The two different terminations (Al- and O-) give rise to qualitatively different results. In the former case, the small adhesion energies per Ag atom are accompanied by a minor interfacial charge transfer, indicating physisorption, which may be explained by a weak atomic polarization. In contrast, for O-terminated corundum, substantial adhesion energies per Ag atom combined with a noticeable charge transfer towards the substrate up to formation of Ag+ ions give a cl

Original languageEnglish
Pages (from-to)247-252
Number of pages6
JournalMaterials Science and Engineering C
Volume23
Issue number1-2
DOIs
Publication statusPublished - 15 Jan 2003

Keywords

  • Ab initio calculations
  • Ag adhesion
  • Atomic/electronic structure
  • Metal oxides substrates

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