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Bi2Se3 interlayer treatments affecting the Y3Fe5O12 (YIG) platinum spin Seebeck effect

  • Yaoyang Hu*
  • , Michael P. Weir*
  • , H. Jessica Pereira
  • , Oliver J. Amin
  • , Jem Pitcairn
  • , Matthew J. Cliffe
  • , Andrew W. Rushforth
  • , Gunta Kunakova
  • , Kiryl Niherysh
  • , Vladimir Korolkov
  • , James Kertfoot
  • , Oleg Makarovsky
  • , Simon Woodward
  • *Corresponding author for this work
  • University of Nottingham
  • University of Southampton
  • University of Latvia
  • Park Systems UK Limited

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

In this work, we present a method to enhance the longitudinal spin Seebeck effect at platinum/yttrium iron garnet (Pt/YIG) interfaces. The introduction of a partial interlayer of bismuth selenide (Bi2Se3, 2.5% surface coverage) interfaces significantly increases (by ∼380%-690%) the spin Seebeck coefficient over equivalent Pt/YIG control devices. Optimal devices are prepared by transferring Bi2Se3 nanoribbons, prepared under anaerobic conditions, onto the YIG (111) chips followed by rapid over-coating with Pt. The deposited Pt/Bi2Se3 nanoribbon/YIG assembly is characterized by scanning electron microscope. The expected elemental compositions of Bi2Se3 and YIG are confirmed by energy dispersive x-ray analysis. A spin Seebeck coefficient of 0.34-0.62 μV/K for Pt/Bi2Se3/YIG is attained for our devices, compared to just 0.09 μV/K for Pt/YIG controls at a 12 K thermal gradient and a magnetic field swept from −50 to +50 mT. Superconducting quantum interference device magnetometer studies indicate that the magnetic moment of Pt/Bi2Se3/YIG treated chips is increased by ∼4% vs control Pt/YIG chips (i.e., a significant increase vs the ±0.06% chip mass reproducibility). Increased surface magnetization is also detected in magnetic force microscope studies of Pt/Bi2Se3/YIG, suggesting that the enhancement of spin injection is associated with the presence of Bi2Se3 nanoribbons.

Original languageEnglish
Article number223902
JournalApplied Physics Letters
Volume123
Issue number22
DOIs
Publication statusPublished - 27 Nov 2023

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