Abstract
Tungsten oxyfluoride films were prepared by reactive dc sputtering in plasmas containing O2+CF4 The deposition rate was large, particularly when chemical sputtering was promoted by heating the target. The films could show large charge insertion/extraction and high coloration efficiency.
| Original language | English |
|---|---|
| Pages (from-to) | 1998-2000 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 65 |
| Issue number | 16 |
| DOIs | |
| Publication status | Published - 1994 |
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