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Growth, crystal structure and stability of Ag-Ni/Cu films

  • I. K. Bdikin*
  • , G. K. Strukova
  • , G. V. Strukov
  • , V. V. Kedrov
  • , D. V. Matveev
  • , S. A. Zver'kov
  • , A. L. Kholkin
  • *Corresponding author for this work
  • Institute of Solid State Physics
  • University of Aveiro

Research output: Chapter in Book/Report/Conference proceedingConference paperResearchpeer-review

6 Citations (Scopus)

Abstract

AgxNi1-x (x=0.0-1.0) films were grown on Cu substrates by electrodeposition method. The films were found to be a nanocrystalline mixture of pure silver and nickel. The grain sizes were determined by X-ray diffraction and electron microscopy techniques. The minimal value was 3.3 nm for the alloy with 70 wt% concentration of Ni. The stability of the grown films upon heating in air and in vacuum was examined. An increase in the grain size was found to begin at 150°C.

Original languageEnglish
Title of host publicationFast Software Encryption - 14th International Workshop, FSE 2007, Revised Selected Papers
PublisherTrans Tech Publications Ltd
Pages1166-1170
Number of pages5
EditionPART 2
ISBN (Print)9780878494026
DOIs
Publication statusPublished - 2006
Externally publishedYes
Event3rd International Materials Symposium and 12th Portuguese Materials Society Meeting 2005 - Aveiro, Portugal
Duration: 20 Mar 200523 Mar 2005

Publication series

NameMaterials Science Forum
NumberPART 2
Volume514-516
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference3rd International Materials Symposium and 12th Portuguese Materials Society Meeting 2005
Country/TerritoryPortugal
CityAveiro
Period20/03/0523/03/05

Keywords

  • Alloys
  • Electrodeposition
  • Materials processing
  • Nanocrystalline
  • Structure

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