Layer-by-Layer Chitosan/PCL Electrospun Membrane Loaded with Copper Nanoparticles as Antibacterial Wound Healing Dressing

Wound healing is a multifaceted process influenced by numerous factors, including bacterial infections that can lead to complications. Chronic wounds, often burdened by bacterial colonization, require antimicrobial agents to prevent contamination and infection. The prevalence of multi-drug-resistant bacteria complicates wound healing, highlighting the need for new solutions. In our research, we developed electrospun Chitosan/PCL patches embedded with copper nanoparticles (CuNPs), conducting a thorough analysis of their properties and effectiveness. CuNPs have previously demonstrated effectiveness in disrupting bacterial cell walls, affecting signaling pathways vital for bacterial survival and colony expansion. In addition, chitosan also exhibited antibacterial activities and demonstrated the ability to facilitate wound healing. Our findings reveal that CuNPs possess antibacterial activity within specific concentration ranges and are highly biocompatible. These Ch/PCL-CuNP materials significantly inhibit bacterial growth in vitro, showcasing their potential as medical composites and offering a promising alternative in combating antimicrobial resistance.